Heat-resistant sensing and computing chips made of silicon carbide can pursue aircraft, power and gas-operated vehicles, renewable energy, defense and space exploration-and researchers at the University of Michigan can carry out a multimilian to bring more of them to the market The dollar has led the cooperative effort.
Nurtured by the Silicon intersection Microelectronics Commons Hub, the project is launched with $ 2.4 million in initial funding, and can get up to $ 7.5 million in three years.
Engineer of NASA’s Glenn Research Center, Silicon Carbide, or SIC is discovering the ability, as one High performance semiconductor For decades. SIC devices can handle high voltage, temperature and radiation levels than silicon alone. With an eye towards discovering the surface of Venus, they created a SIC circuit that could withstand 930 f (500 c) for thousands of hours. NASA Glenn has also shown device operations packed by 1,800 F (1,000 c) temperature duration -310 F (-190C) to 1,490 F (812C) with relevance in aerospace.
SIC can be valuable for more than space missions – it is rapidly used in electrical vehicles and solar and wind power systems. However, these applications are not taking maximum advantage of its flexibility for extreme conditions.
The new project will bring NASA’s technology and manufacturing process to a modern wafer size and will democratizing SIC chip design. Along with NASA, colleagues include GE Aerospace Research NiskayunaNew York; A technology firm in Ozark Integrated Circuit (Ozark IC), Fieteville, Arkansas; And Volfspeed, a northern carolina-based semiconductor manufacturer.
While a wide range of technology sectors can be useful, the project will focus on aerospace, including electronics and sensors that make the aircraft engine more reliable and help to adapt their size, weight and power. A major target is the performance of a packed actuator for aerospace or engine applications. Actuators convert electrical signals into mechanical speed and play an important role in control systems.
Participation with industry and government
“NASA, GE Aerospace and Ozark IC have done a wonderful job of developing this technology, which is very impressive for various types of applications. This project will provide an important route to pursue and commercialize that technology, “Principal investigator said. Becky PetersonAssociate Professor of Electrical and Computer Engineering and Director of UM Luri Nanophysics Facility.
“We need domesticly produced advanced semiconductors that can perform in these challenging high temperature environment.”
In the project, NASA Glenn and GE Aerospace will work together, which will be referred to as a high-temperature SIC Junction Field Effect Transistor, or JFET, construction process, from 100– to 150-mileimeter wafers.
“SIC-based high temperature electronics will be an important promoter to provide new sensors and actuater functionality that improves the capacity of future DOD engine platforms. Beyond the jet engine, the ability to handle more extreme temperature capabilities can open exciting new applications in control and sensing for hypersonic applications, “Aaron Nobloch, Platform Leader, Control and Electrical System said GE Aerospace Research said.
Ozark IC, who has worked with NASA Small Business Innovation Research Program with NASA Glenn and licensing offices for many years, will support packaging, integration and process commercialization. Ozark IC has shown a way for the technology that works more than the integrated 1,400 F (800C) integrated with advanced packaging.
The program creates the functions of the current department of Ozark IC with NASA, where DARPA has supported SIC JFET-R technology infection for the facility of 100 mm of GE Aerospace in New York, and DARPA is high operating temperature sensors (HOTS ) Its application for aerospace sensing through the program. ,
Volfspeed, a leading and leader in SIC wafer production, will provide special SIC wafers required for the manufacture of these devices on its deeper expertise and ability in the epistaxi of SIC. The Volfspeed and the US Department of Commerce are finalizing a proposed $ 750 million direct funding package to support the expansion of Volfspeed Silicon carbide production in Northern Carolina and New York. In addition, Volfspid will consult with the team on the design for commercialization.
“Ozark IC has been working with NASA and GE aerospace in bringing SIC technology in aerospace and energy for many years. Can’t be thrilled to work together.
Michigan Engineering Researcher A process will refine and standardize the development kit and transistor model. They will manufacture libraries of commonly used circuit blocks to make SIC technology more accessible to integrated circuit designers.
“We will test the equipment and circuits made by NASA and GE Aerospace and the Ozark packed by the IC and will work together to standardize those pieces,” Peterson said. “And we will use data using data to create process development kits and electronic design automation, or open EDA, software that can help Automate the design of the integrated circuit, and model their performanceWe want to develop advanced sophisticated models so that future users have all the equipment that they need to design and manufacture commercial products in this exciting technique. ,
To do this, a team Under the leadership of David ventzloffUM professor of electrical and computer engineering will add to unique Open-source tools that they have developed to design analog and mixed-component circuitThese are important for managing circuit power, converting real -world data from sensors to digital information for processing and driving actuators and controllers in jet engines. Analog circuits complement digital people that perform processing and memory tasks. While open-source design tools for digital circuits are becoming increasingly common, Um brings them into analog realm to apply analog and digital system on SIC chip.
“Our system is contrary to other former analog circuit design automation tools,” said Ventzloff. “The primary difference is that we manufacture very mature digital design at the top of the automation tools. Instead, the digital design analog circuit designed with the automation tool. Makes designers more accessible to a wide range.
Aerospace engine improves reliability
Today’s silicon-based electronics are used in engine control systems, limited to 257 f (125C) and should be preserved from heat through complex and heavy cooling systems or located in cooler areas of the engine Needed SIC can function in warm areas within electronics engines and their exit systems. The technology installed in this project will enable new sensors and actuator functionality, flexible modular control system, low weight and simple engine electrical system architecture. Due to the ability of SIC to handle excessive temperature, SIC electronics can also pursue emerging hypersonic aircraft systems that work at temperatures beyond silicon’s capabilities.
The title of the project is: “Improves the reliability of the engine and swap with a 350-500 C SIC electronic system.” This is one in 34 Technical projects funded by US Defense Department in 2024 through Microelectronic Commons ProgramEstablished by the Chips Act to expand American leadership in microelectronics.
Michigan University is one Founder member The Silicon intersection under the leadership of the Applied Research Institute is from the microelectronics common hub. SCMC hub Taking advantage of strong associate practices, an innovation ecosystem of diverse partners to accelerate the expansion of America’s microelectronic base is an innovative ecosystem that supports strategic innovation, workforce development and infrastructure, which to achieve domestic microelectronic excellence Needed.
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